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searching for MIL-STD-883 5 found (16 total)

Pull off test (222 words) [view diff] exact match in snippet view article find links to article

necessary, to eliminate surface skin effects. "MIL-STD-883 2011.9 bond strength (bond pull test)". "MIL-STD-883 method 2031.1 Flip-chip pull-off test". Archived

Human-body model (270 words) [view diff] exact match in snippet view article find links to article

used is the test model defined in the United States military standard, MIL-STD-883, Method 3015.9, Electrostatic Discharge Sensitivity Classification. This

Wire bonding (2,442 words) [view diff] exact match in snippet view article find links to article

(3D-PEIM), 2016. MIL-STD-883: Test Method Standard for Microcircuits, Method 2011.7 Bond Strength (Destructive Bond Pull Test) MIL-STD-883: Test Method Standard

Solderability (389 words) [view diff] case mismatch in snippet view article find links to article

and look method is a qualitative test. One form of it is specified as Mil-Std-883 Method 2003. On the other hand, the wetting balance analysis is a quantitative

ESD simulator (480 words) [view diff] exact match in snippet view article find links to article

EMC ISO/EN 61000-4-2 needed for the CE mark IEC 61000-4-2 ISO TR10605 MIL-STD-883 MIL-STD-1512 GR-78-CORE RTCA/DO 160 "Test Laboratory". Phoenix Testlab