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searching for Chip-scale package 5 found (20 total)

Ndubuisi Ekekwe (547 words) [view diff] no match in snippet view article find links to article

accelerometer for the iPhone and created the company's first wafer level chip scale package for inertial sensor. He is a player in the U.S. semiconductor industry

Nemotek Technologie (497 words) [view diff] exact match in snippet view article find links to article

Technologie announced a new WLP technology, which provides a true chip-scale package with a minimum thickness of 400om. The die size is 0.6mm, which fitting

Bahgat G. Sammakia (810 words) [view diff] no match in snippet view article find links to article

T.; Sammakia, B.G. (June 2001). "Computational parameter study of chip scale package array cooling". IEEE Transactions on Components and Packaging Technologies

Microlens (2,098 words) [view diff] no match in snippet view article find links to article

methodology can now be used to fabricate wafer-level optical elements in a chip scale package. The result is a wafer-level camera module that measures .575 mm x

Three-dimensional integrated circuit (8,790 words) [view diff] no match in snippet view article find links to article

Laser Dicing Process and its Reliability for Various Designs of Stack Chip Scale Package". Retrieved 2014-05-15.[permanent dead link] "High Density PoP (Package-on-Package)