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Longer titles found: Embedded wafer level ball grid array (view)

searching for Ball grid array 13 found (105 total)

Stealey (239 words) [view diff] exact match in snippet view article find links to article

Physical specifications Transistors 176 million Cores 1 Package Micro ball grid array (mPGA) Socket mBGA479 Models Intel A100 Intel A110 History Predecessor

Intel Core 2 (1,151 words) [view diff] exact match in snippet view article find links to article

Flip-chip land grid array (FC-LGA) Micro pin grid array (mPGA) Flip-chip ball grid array (FC-BGA) Sockets Socket T (LGA 775) Socket M (μPGA 478MT) Socket P

Alchemy (processor) (1,759 words) [view diff] exact match in snippet view article

(earlier models) standard package. A low profile, fine pitch plastic ball grid array (LF-PBGA) package was used for all models, with ball counts from 324

Microbead (research) (906 words) [view diff] case mismatch in snippet view article

(2010). "Life Cycle Assesment [sic] of Electronics. Ugelstad-particles Ball Grid Array and Chip Scale Packaging". ResearchGate. Rangnes 1997:4–5 In 1977:

Pentium M (1,759 words) [view diff] exact match in snippet view article find links to article

million Cores 1 Packages Micro pin grid array (mPGA) High performance ball grid array (H-PBGA) Sockets Socket 479 H-PBGA479 Products, models, variants Core names

Telit Cinterion (1,341 words) [view diff] no match in snippet view article find links to article

enhance its global IoT connectivity offering. The company developed the ball-grid-array (BGA) module; the “Family” and “Unified-Form-Factor” concepts; the

ModeFRONTIER (1,269 words) [view diff] case mismatch in snippet view article find links to article

Strandberg; Makkonen; Leinvuo. "Multi-Objective Optimization of a Ball Grid Array Using modeFRONTIER & COMSOL Multiphysics" (PDF). Retrieved 2023-08-25

Bahgat G. Sammakia (810 words) [view diff] exact match in snippet view article find links to article

(June 2000). "A numerical study of the thermal performance of a tape ball grid array (TBGA) package". Journal of Electronic Packaging. 122 (2): 107–114

Intel 850 (926 words) [view diff] case mismatch in snippet view article find links to article

chipsets. The 82850 series was supplied in the FC- BGA package (Flip Chip Ball Grid Array Package) manufactured according to the 0.13 μm process rule. The Intel

PA-8000 (3,114 words) [view diff] exact match in snippet view article find links to article

interconnects and low-κ dielectric. The PA-8800 is packaged in a ceramic ball grid array mounted on a printed circuit board (PCB) with the four ESRAMs, forming

SHAKTI (microprocessor) (2,221 words) [view diff] case mismatch in snippet view article

frequency of up to 350 MHz. The chip has been packaged on a 208-pin Ball Grid Array (BGA). Moushik is the code name of the Shakti E-class based SoC that

Raptor Lake (3,223 words) [view diff] exact match in snippet view article find links to article

execution units) Packages Flip-chip land grid array (FC-LGA) Flip-chip ball grid array (FC-BGA) Sockets Desktop/Server: LGA 1700 Mobile: BGA 1744 BGA 1792

Scanning SQUID microscopy (5,449 words) [view diff] case mismatch in snippet view article find links to article

Circuit Board (PCB). Advanced wire-bond packages, unlike traditional Ball Grid Array (BGA) packages, have multiple pad rows on the die and multiple tiers