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searching for Back end of line 6 found (22 total)

Semiconductor device fabrication (11,851 words) [view diff] no match in snippet view article find links to article

Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as microprocessors

Integrated circuit (9,193 words) [view diff] no match in snippet view article find links to article

solder bump for flip-chip bonding. It also shows the section for FEOL (front-end of line), BEOL (back-end of line) and first parts of back-end process.

Semiconductor process simulation (1,631 words) [view diff] exact match in snippet view article find links to article

and drain contacts—also known as front end of line manufacturing. Back end of line manufacturing, e.g. interconnect and dielectric layers are not considered

Color filter array (2,285 words) [view diff] exact match in snippet view article find links to article

that the CFAs are deposited on the image sensor surface at the BEOL (back end of line, the later stages of the integrated circuit manufacturing line), where

Everspin Technologies (1,906 words) [view diff] no match in snippet view article find links to article

Everspin owns and operates a manufacturing line for its magnetic back-end-of-line wafer processing, using standard CMOS wafers from foundries.[citation

Francesca Iacopi (2,288 words) [view diff] no match in snippet view article find links to article

Beyer, “Challenges in the implementation of low-k dielectrics in the back-end of line”, Microelectron.Eng. 80, pp. 337–344, 2005. N.Mishra, J.Boeckl, N.Motta