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Wafer dicing is a redirect to Die singulation

searching for Wafer dicing 4 found (19 total)

Radio-frequency microelectromechanical system (3,776 words) [view diff] exact match in snippet view article find links to article

require single chip packaging. Wafer-level packaging is implemented before wafer dicing, as shown in Fig. 3(a), and is based on anodic, metal diffusion, metal

Electro Scientific Industries (2,176 words) [view diff] exact match in snippet view article find links to article

manufacturing. The company’s semiconductor products include automated ultra-thin wafer dicing and high-throughput, high-accuracy grooving systems. In the area of component

Indium gallium arsenide (3,771 words) [view diff] exact match in snippet view article find links to article

generate micron-size particles of GaAs and InP. Similar concerns apply to wafer dicing to make individual devices. This particle dust can be absorbed by breathing

Nanoelectromechanical systems (5,328 words) [view diff] exact match in snippet view article find links to article

account for 75–95% of the overall costs of MEMS and NEMS. Factors of wafer dicing, device thickness, sequence of final release, thermal expansion, mechanical