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searching for Die shrink 29 found (59 total)

alternate case: die shrink

List of Intel CPU microarchitectures (2,873 words) [view diff] exact match in snippet view article find links to article

(die shrink) 3333 45 nm 2008 Nehalem 20 unified (14 without miss prediction) 3600 Bonnell 16 (20 with prediction miss) 2100 2010 Westmere (die shrink)

Nehalem (microarchitecture) (1,419 words) [view diff] no match in snippet view article

retaining some of the latter's minor features. Nehalem later received a die-shrink to 32 nm with Westmere, and was fully succeeded by "second-generation"

List of AMD CPU microarchitectures (1,128 words) [view diff] exact match in snippet view article find links to article

Family 15h (3rd-gen) – third-generation Bulldozer (Second optimisation and die shrink to 28 nm). CPUID model numbers are 30h-3Fh. AMD Excavator Family 15h (4th-gen)

Texas Instruments LPC Speech Chips (1,614 words) [view diff] exact match in snippet view article find links to article

table. The CD2801/Die revision F fixes an interpolator bug. TMS5100A: Die shrink of TMS5100/TMC0281. Very minor differences in function, uses die rev F

VIA C3 (1,177 words) [view diff] exact match in snippet view article find links to article

processor continued an emphasis on minimizing power consumption with the next die shrink to a mixed 130/150 nm process. "Ezra" (C5C) and "Ezra-T" (C5N) were only

List of Super NES enhancement chips (2,088 words) [view diff] exact match in snippet view article find links to article

but with different microcode. The DSP-1 version, including the later 1A die shrink and 1B bug fix revisions, was most often used; the DSP-2, DSP-3, and DSP-4

List of Intel codenames (1,536 words) [view diff] exact match in snippet view article find links to article

named after Averill, a town in Essex County, Vermont. 2005 Avoton SoC Die shrink of Centerton to 22 nm. A historical place in Putnam County, Tennessee

NetBurst (1,648 words) [view diff] no match in snippet view article find links to article

two Cedar Mill cores on two separate dies (Cedar Mill being the 65 nm die-shrink of Prescott). Intel had Netburst-based successors in development called

Immersion lithography (1,025 words) [view diff] case mismatch in snippet view article find links to article

ISSN 1932-5150. "DailyTech - IDF09 Intel Demonstrates First 22nm Chips Discusses Die Shrink Roadmap". Archived from the original on 2010-08-28. Retrieved 2009-12-07

Intel (23,989 words) [view diff] exact match in snippet view article find links to article

continued its tick-tock model of a microarchitecture change followed by a die shrink until the 6th-generation Core family based on the Skylake microarchitecture

GeForce 600 series (2,721 words) [view diff] no match in snippet view article find links to article

(N13M-GS) 28 96:16:4 625 1250 1800 2.5 10 14.4 28.8 64 128 240 15 OEM. Die-Shrink GF108 GeForce GT 625M October 2012 GF117 (N13M-GS) 14.4 64 GeForce GT

RL78 (2,131 words) [view diff] exact match in snippet view article find links to article

replaced the original NEC 78K0R/Fx3 devices with many updates including die shrink, faster core speed (32MHz), improved on-chip debug capability, new peripherals

Pentium III (3,033 words) [view diff] exact match in snippet view article find links to article

it was released against, which was reversed when AMD applied their own die shrink and added an on-die L2 cache to the Athlon. Athlon held the advantage

Quad flat package (1,160 words) [view diff] exact match in snippet view article find links to article

of 0.4 mm. TQFPs help solve issues such as increasing board density, die shrink programs, thin end-product profile and portability. Lead counts range

List of Intel processors (13,517 words) [view diff] exact match in snippet view article find links to article

technology 3.0–3.6 GHz (model numbers 6x1) Introduced January 16, 2006 Die shrink of Prescott-2M Same features as Prescott-2M Family 15 Model 4 Dual-core

Radeon R100 series (2,287 words) [view diff] no match in snippet view article find links to article

Mobility Radeon notebook solution. The Radeon 7500 (RV200) is basically a die-shrink of the R100 in a new 150 nm manufacturing process. The increased density

WinChip (976 words) [view diff] exact match in snippet view article find links to article

Another revision, the WinChip 2B, was also planned. This featured a die shrink to 0.25 μm, but was only shipped in limited numbers. A third model, the

Depletion-load NMOS logic (2,944 words) [view diff] no match in snippet view article find links to article

each generation was deliberately designed to allow existing layouts to die-shrink with no major changes. Various techniques were introduced to ensure the

PlayStation 5 (10,325 words) [view diff] exact match in snippet view article find links to article

series), for both the base and digital versions of the PS5, which used a die shrink of the original SoC. This lowered the power draw of the SoC and Sony redesigned

Pentium 4 (5,303 words) [view diff] exact match in snippet view article find links to article

the Pentium 4 was Cedar Mill, released on January 5, 2006. This was a die shrink of the Prescott-based 600 series core to 65 nm, with no real feature additions

R10000 (2,607 words) [view diff] exact match in snippet view article find links to article

The use of a new process does not mean that the R12000 was a simple die shrink with a tweaked microarchitecture; the layout of the die is optimized to

Celeron (5,855 words) [view diff] exact match in snippet view article find links to article

boost in performance over Sandy Bridge-based Celerons due to a 22 nm die shrink, as well as some other minor improvements. All Celerons of this generation

Intel 8086 (4,993 words) [view diff] exact match in snippet view article find links to article

(June 2020). "A look at the die of the 8086 processor". — (June 2020). "Die shrink: How Intel scaled down the 8086 processor". — (July 2020). "The Intel

Radeon (5,347 words) [view diff] no match in snippet view article find links to article

fill-rate efficiency through the new HyperZ technology. The RV200 was a die-shrink of the former R100 with some core logic tweaks for clockspeed, introduced

Matrox G400 (2,064 words) [view diff] exact match in snippet view article find links to article

to the G400 line. Like the G250 was to the G200, G450 was primarily a die shrink of the G400 core from the 250 nm semiconductor fabrication process to

GeForce (5,993 words) [view diff] exact match in snippet view article find links to article

mid-range and OEM/mainstream cards to be integrated into the 8 series. The die shrink down to 65 nm and a revision to the G80 design, codenamed G92, were implemented

Flash memory (16,843 words) [view diff] no match in snippet view article find links to article

partially full.[vague] Even when the only change to manufacturing is die-shrink, the absence of an appropriate controller can result in degraded speeds

List of Nvidia graphics processing units (11,807 words) [view diff] no match in snippet view article find links to article

(N13M-GS) 28 96:16:4 625 1250 1800 2.5 10 14.4 28.8 64 128 240 15 OEM. Die-Shrink GF108 GeForce GT 625M October 2012 14.4 64 GeForce GT 630M April 2012

List of computer technology code names (8,265 words) [view diff] exact match in snippet view article find links to article

PCi—based SunPC card Penryn — Intel Core 2 "Core architecture" 45 nm die shrink with SSE4 Pensacola — Red Hat Linux AS 2.1 / RHEL 2.1 AS Perestroika —