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searching for Copper interconnects 18 found (38 total)

alternate case: copper interconnects

Tantalum nitride (749 words) [view diff] exact match in snippet view article find links to article

TaN find use as a diffusion barrier and insulating layer between copper interconnects in the back end of line of computer chips. Tantalum nitrides are
Hardmask (356 words) [view diff] exact match in snippet view article find links to article
(carbon doped hydrogenated silicon oxide), a material used to insulate copper interconnects, requires an etchant that attacks silicon compounds. For this material
Carbon nanotubes in interconnects (4,726 words) [view diff] exact match in snippet view article find links to article
interconnect material for the future technology generations and to replace copper interconnects. Electron transport can go over long nanotube lengths, 1 μm, enabling
Alpha 21264 (2,673 words) [view diff] exact match in snippet view article find links to article
940 MHz. The EV68C was fabricated in a 0.18 μm CMOS process with copper interconnects. It was sampled in early 2000 and achieved a maximum clock frequency
PowerPC G4 (1,885 words) [view diff] exact match in snippet view article find links to article
0.20 μm HiPerMOS6 process. The die measures 83 mm2 and features copper interconnects. Motorola had promised Apple to deliver parts with speed up to 500 MHz
Advantest (530 words) [view diff] exact match in snippet view article find links to article
other advanced ICs that incorporate complex technologies such as copper interconnects, sub-100 nm device geometries and 300mm wafers. Astronics Corporation
IBM RS64 (1,582 words) [view diff] exact match in snippet view article find links to article
version called IStar manufactured with a SOI fabrication process with copper interconnects, which increased the processor's clock frequency to 600 MHz. This
Electron tomography (1,576 words) [view diff] exact match in snippet view article find links to article
Gignac, L. M. (2006). "Three-dimensional imaging of nanovoids in copper interconnects using incoherent bright field tomography". Applied Physics Letters
Luxman (2,032 words) [view diff] exact match in snippet view article find links to article
the Luxman C-05 and M-05, with their finish, electrical designs (copper interconnects, Class A amp design, separately powered channels with dual AC cables
ISO/IEC 11801 (1,682 words) [view diff] exact match in snippet view article find links to article
several link/channel classes and cabling categories of twisted-pair copper interconnects, which differ in the maximum frequency for which a certain channel
Moore's law (11,038 words) [view diff] exact match in snippet view article find links to article
or chemical mechanical planarization (CMP), trench isolation, and copper interconnects—although not directly a factor in creating smaller transistors—have
International Electron Devices Meeting (1,917 words) [view diff] case mismatch in snippet view article find links to article
Power Devices at 2016 IEDM" (October 26, 2016), PowerPulse.net "Copper Interconnects" IBM 100 Icons of Progress "IEDM 2019 Keynotes and Memory Technology"
Athlon (4,910 words) [view diff] exact match in snippet view article find links to article
a fast rate, with the process technology improved by a switch to copper interconnects. After several versions were released in 2000 and 2001 of the Thunderbird
Potential applications of carbon nanotubes (15,064 words) [view diff] exact match in snippet view article find links to article
conductor. Hybrid interconnects that employ CNT vias in tandem with copper interconnects may offer advantages from a reliability/thermal-management perspective
Open microfluidics (4,371 words) [view diff] case mismatch in snippet view article find links to article
PMID 17608505. Gambino J (2011). "Process Challenges for Integration of Copper Interconnects with Low-k Dielectrics". ECS Transactions. 35 (4). Montreal, QC,
Potential applications of graphene (15,190 words) [view diff] exact match in snippet view article find links to article
was more pronounced in thinner copper films, which is useful as copper interconnects shrink. Attaching graphene functionalized with silane molecules increases
List of fellows of IEEE Electron Devices Society (69 words) [view diff] exact match in snippet view article find links to article
of superconductor tapes 2019 Munehiro Tada For contributions to copper interconnects for very-large-scale integration 2019 Harkhoe Tan For contributions
List of fellows of IEEE Solid-State Circuits Society (73 words) [view diff] exact match in snippet view article find links to article
field-effect transistors 2019 Munehiro Tada for contributions to copper interconnects for very-large-scale integration 2019 ShaoJun Wei for leadership